a - 2006 14 - jun. lg63430/h0-pf ligitek electronics co.,ltd. property of ligitek only lg63430/h0-pf round type led lamps data sheet doc. no : qw0905- rev. : date : lead-free parts pb
1/5 page lg63430/h0-pf part no. ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is ?
2/5 page ligitek electronics co.,ltd. property of ligitek only typical electrical & optical characteristics (ta=25 # ) absolute maximum ratings at ta=25 # note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. viewing angle 2 $ 1/2 (deg) 52 min. 20 min. forward voltage @ ma(v) max. lens peak wave length % pnm spectral halfwidth &% nm 20 1.7 2.6 30 565 luminous intensity @10ma(mcd) 45 typ. emitted part no material green lg63430/h0-pfgap green diffused color unit ma ma ' a # # mw 30 120 g ratings 10 ir -40 ~ +85 -40 ~ +100 100 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature reverse current @5v power dissipation symbol t opr tstg i f pd i fp part no. lg63430/h0-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( # ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 # fig.4 relative intensity vs. temperature ambient temperature( # ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 # typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 3/5 part no. lg63430/h0-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 ! 25 ! 2 /sec max 100 50 150 time(sec) temp( c) 120 ! 260 ! 5 /sec max 260 c3sec max 60 seconds max part no. lg63430/h0-pf
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=260 # 5 # 2.dwell time= 10 1sec. 1.t.sol=230 # 5 # 2.dwell time=5 1sec solder resistance test solderability test this test intended to see soldering well performed or not. jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only description test itemtest condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 # 5 # &-40 # 5 # (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature high humidity test thermal shock test operating life test high temperature storage test the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. reliability test: reference standard page 5/5 part no. lg63430/h0-pf
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